TINGYU

Leading, Efficient, Reliable
AI Compute Factory

From a single inference API call to a full compute campus delivery.

TINGYU is an independent AI computing operator — full-stack self-built, end-to-end service.

01 / Infrastructure

Purpose-Built AI Campuses

We don't retrofit legacy data centers. Every TINGYU campus is designed from scratch for AI workloads — power planning, cooling architecture, network topology, and ops systems, all deeply customized. Post-delivery, we operate with precision: grid-compute co-scheduling keeps everything running at peak efficiency.

AI Workload DemandPower SystemGrid-Compute SynergyGreen Direct · Source-Grid-Load-StorageNetwork TopologyHigh-Perf InterconnectRDMA · Adaptive RoutingCooling ArchitectureCold Plate Liquid CoolingLow PUE · High-Density ThermalOperations SystemPrecision OperationsSelf-Healing · Elastic ScalingFull-Stack Deep CustomizationGround-Up Design · Delivery & Ops · Grid-Compute Synergy
02 / Compute

GPU Cluster Delivery & Ops

TINGYU delivers ready-to-use clusters at scale — from hardware selection, racking, interconnect, commissioning to stress testing. After delivery, we provide ongoing cluster operations: self-healing, utilization optimization, and elastic scaling.

Cluster Delivery PipelineSelectionMatch optimal GPU model & cluster scale to workloadRacking & Interconnect400G/800G/1.6T RDMA iterative evolutionCommission & Test10K+ compute cluster turnkey deliveryOngoing OpsSelf-healing · Utilization optimization · Elastic scalingProduction-Ready Cluster
03 / Network

High-Performance GPU Interconnect

Purpose-built deployment by TINGYU, outperforming traditional high-end solutions in cost-efficiency with field-validated performance.

Inter-NodeLossless EthernetAdaptive Routing50% BW Uplift400GbE RDMAIntra-NodeDirect Bus Connect~900GB/s Bi-dirLower CostGPUGPUGPUGPU~900GB/s Bi-directional
GPU Heat SourceChip power climbing to kilowatt-classHardware Cold PlateDirect chip-contact cooling40%+ efficiency gainFacility Liquid CoolingCoolant Distribution UnitPrimary / secondary loopCoolantPUE < 1.15Liquid-first · Low-carbon · kW-ready
04 / Thermal

Liquid Cooling for the Next Generation

As GPU power climbs toward kilowatt-class, liquid cooling becomes inevitable. TINGYU is advancing two parallel tracks: hardware-level cold plate solutions for direct chip cooling, and facility-level liquid cooling architectures that redesign the entire thermal loop — ready for next-gen GPUs.

05 / Energy

Grid-Compute Synergy: Power Follows Compute

TINGYU connects western campuses directly to wind and solar sources. Our proprietary co-scheduling system dynamically matches power supply to compute demand — not just for cost savings, but as a fundamentally new operating model where energy infrastructure deeply integrates with AI workloads.

Source · Green EnergyWindSolarStorageGreen Direct SupplyDedicated line · 40%+ cost reductionGrid-Compute Co-SchedulingPower supply matches compute demand in real-timeIntegrated source-grid-load-storage managementPower InCompute OutPower Follows Compute
07 / Infrastructure

Multi-tier Compute Network

From hyperscale clusters to city-level edge nodes — full coverage for every AI inference scenario

GS(2024)0650号
National Computing HubsRegional Computing CentersDistributed Edge Network
100K+
GPUs
30+
Nationwide Nodes
2T+
Daily Tokens

Ready to secure your compute?

Whether it's a single API call or an entire compute campus — we're ready.